ABSTRACT: TI OMAP applications processors are powerful and flexible; this makes them well suited for managing difficult power and thermal constraints.
However, the complexity of OMAP parts is high and the ways in which to use them are varied and intricate.
This article addresses the problem of managing thermal performance in a battery-powered product design with TI OMAP processors, and also includes a special case study on the OMAP4430-based Amazon Kindle Fire.
Mark Benson is Vice President of Engineering at SmartThings, a technology company based in Mountain View, CA and a wholly owned subsidiary of Samsung Electronics. Mark is a regular speaker and writer on the intersection of technology, business, and society as it relates to product development, technology leadership, strategic planning and execution, intellectual property portfolio management, software architecture, information security, competitive positioning, and organizational behavior.