ABSTRACT: TI OMAP applications processors are powerful and flexible; this makes them well suited for managing difficult power and thermal constraints.
However, the complexity of OMAP parts is high and the ways in which to use them are varied and intricate.
This article addresses the problem of managing thermal performance in a battery-powered product design with TI OMAP processors, and also includes a special case study on the OMAP4430-based Amazon Kindle Fire.
Mark Benson is Head of Product & Engineering at Samsung SmartThings. Mark is the author of The Art of Software Thermal Management for Embedded Systems and is a regular speaker and writer on the intersection of technology, business, and society as it relates to strategic planning, product management, competitive strategy, software engineering leadership, information security, and organizational behavior.