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SOFTWARE THERMAL MANAGEMENT WITH TI OMAP PROCESSORS

02 August 2012 /Mark Benson

Published in the Electronic Engineering Journal (EE Journal), by Mark Benson.

ABSTRACT: TI OMAP applications processors are powerful and flexible; this makes them well suited for managing difficult power and thermal constraints.

However, the complexity of OMAP parts is high and the ways in which to use them are varied and intricate.

This article addresses the problem of managing thermal performance in a battery-powered product design with TI OMAP processors, and also includes a special case study on the OMAP4430-based Amazon Kindle Fire.